Events Name: NEPCON CHINA 2023
Date: July 19 - 21, 2023
Address: No.1099 Guozhan Road, Shanghai
Shinwa TFA booth: Building No. 1 1A45
Shinwa TFA will exhibit the latest Quspa ultra-high precision dispenser and provide on-site demonstrations of solder paste and dispensing.
Applications:1、Solder paste Type7：150μm diameter
2、Silver glue : 130μm diameter
3、DAM dispensing : 16 inch FPC high speed dispensing
4、Other high viscosity materials
