Events Name: NEPCON ASIA 2024
Date: November 6 - 8, 2024
Address: No.1 Zhancheng Rd, Fuhai Street, Bao’an District, Shenzhen
Shinwa TFA booth number: Hall 11, 11H44
We will exhibit the next generation of Quspa-Lx ultra-precision dispenser, the world's first!
We also have dispensing demonstration on site every day!
Applications:
1、Solder paste Type7：150μm diameter dot with 350hz high speed dispensing
2、Silver glue: 130μm diameter
3、Various glue materials: corresponding to wafer dispensing
4、Other high viscosity materials
