The widely acclaimed Shinwa Quspa will soon release the QUSPA-SP, a model for large-size substrates, in 2025. Fully support the packaging production of AI chips with large computing power, which has been laid out by major head packaging manufacturers in recent years.
QUSPA-SP has the following advantages:
1、High speed& High acceleration 4.5G、3000m/sec
2、Linear Servo Drive Gantry System ±3um
3、Automatically generate dispensing program
4、Two dispensing pump
5、Working Area： Max 550×600
| M size | L size | |
| Dimension | 1400x1180x1430㎜ | 1600x1600x1400㎜ |
| Working Area |
MAX: 250×330㎜ MIN: 50×70㎜ |
MAX: 550×600㎜ MIN: 100×100㎜ |
| Weight | 1500Kg | 2500Kg |
Applications:
1、Solder paste Type7：100μm diameter
2、Silver glue : 130μm diameter
3、DAM dispensing : 16-inch FPC substrate high speed dispensing
4、Other high viscosity materials
