Events Name: productronica CHINA 2024
Date: March 20 - 22, 2024
Address: Shanghai New International Expo Centre (SNIEC)
2345 Long Yang Road, Pudong New Area
Shanghai 201204, P.R. China
Shinwa TFA booth number: E6.6288
Shinwa TFA will exhibit the latest Quspa ultra-high precision dispenser and provide advanced solder paste dispensing solutions.
Applications:
1、Solder paste Type7：100μm diameter
2、Silver glue : 130μm diameter
3、DAM dispensing : 16 inch FPC substrate high speed dispensing
4、Other high viscosity materials
