TFA Suzhou will participate in Productronica China 2025 Exhibition from March 26 to March 28. At that time, the equipment Quspa-LX will appear in this exhibition and demonstrate the dispensing on the spot.
Venue: Shanghai New International Expo Center
No.2345, Longyang Road, Pudong New Area, Shanghai
Booth No.: W1.1581
Applications:
1、Solder paste Type7：100μm diameter
2、Silver glue : 130μm diameter
3、DAM dispensing : 16-inch FPC substrate high speed dispensing
4、Other high viscosity materials
