TFA Suzhou will participate in NEPCON ASIA 2025 Exhibition from Oct 28 to Oct 30. At that time, the equipment Quspa-LX will appear in this exhibition and demonstrate the dispensing on the spot.
Venue: Shenzhen World Exhibition & Convention Center (Bao'an New Hall)
No.1 Zhancheng Rd, Fuhai Street, Bao'an District, Shenzhen
Booth No.: Hall 13, 13G30
Applications:
1、Solder paste: 120μm diameter with 350hz high speed dispensing
2、Silver paste: 130μm diameter
3、Various glue materials: corresponding to wafer dispensing
4、Other high viscosity materials
